Read Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969

Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969

Chen-Hua Yu

4.9/5 (30367 ratings)

Description:Semiconductor device, multi-die packages, and methods of manufacture thereof are described. In an embodiment, a semiconductor device may include: first conductive pillars and second conductive pillars respectively aligned to a first row of first pins and a second row of second pins of a first die, the first pins and the second pins differing in function; a first insulating layer covering surfaces of the first conductive pillars and the second conductive pillars facing away from the first die; first pads disposed on a surface of the first insulating layer facing away from the first die, the first pads substantially aligned to the first conductive pillars; and first traces coupled to the first pads, the first traces extending over a portion of the first insulating layer covering the second conductive pillars.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969. To get started finding Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969, you are right to find our website which has a comprehensive collection of manuals listed.
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Pages: 28

Format: PDF, EPUB & Kindle Edition

Publisher: Independently Published

Release: 2020

ISBN

Description: Semiconductor device, multi-die packages, and methods of manufacture thereof are described. In an embodiment, a semiconductor device may include: first conductive pillars and second conductive pillars respectively aligned to a first row of first pins and a second row of second pins of a first die, the first pins and the second pins differing in function; a first insulating layer covering surfaces of the first conductive pillars and the second conductive pillars facing away from the first die; first pads disposed on a surface of the first insulating layer facing away from the first die, the first pads substantially aligned to the first conductive pillars; and first traces coupled to the first pads, the first traces extending over a portion of the first insulating layer covering the second conductive pillars.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969. To get started finding Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969

Semiconductor devices, multi-die packages, and methods of manufacure thereof: United States Patent 9984969

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