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3D IC Stacking Technology

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Description:The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, "3D IC Stacking Technology" offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers."3D IC Stacking Technology" covers: High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technologyWe have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with 3D IC Stacking Technology. To get started finding 3D IC Stacking Technology, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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Format: PDF, EPUB & Kindle Edition

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ISBN: 0071741968

Description: The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, "3D IC Stacking Technology" offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers."3D IC Stacking Technology" covers: High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technologyWe have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with 3D IC Stacking Technology. To get started finding 3D IC Stacking Technology, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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3D IC Stacking Technology

3D IC Stacking Technology

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